200631 · The lapping-based manufacturing method currently used to manufacture the majority of silicon wafers will not be able to meet the ever-increasing demand for flatter wafers and lower prices. A grinding-based manufacturing method has been investigated experimentally to demonstrate its potential to manufacture flat silicon wafers at a lower cost.
view more202082 · Grinding is one of the machining methods by using the abrasive grains to achieve high-efficiency and precision machining of mechanical components. The grinding process is achieved by a grinding wheel consisting of abrasive grains held together with special bonding material. The actual cutting points of abrasive grains act as micro-cutting …
view more201311 · Abstract Although diamond grinding is the most commonly used machining technique in silicon wafer thinning, it often induces edge chipping which leads to wafer breakage. This study investigates edge chipping of silicon wafer in diamond grinding. The study correlates edge chipping with the crystallographic orientation and thickness of a …
view moreJSG has launched special processing machines for cylindrical rolling & grinding, which can process silicon ingots with diameters of 8 inches and 12 inches, featuring high processing precision, high degree of automation and strong stability
view more20231115 · In response to these limitations and from the frequency domain perspective, this paper proposes an innovative surface roughness (Ra) predictive model for silicon nitride ceramics grinding based on the dynamic grinding force model.
view moreThe Blanchard vertical rotary surface grinder is the right choice for providing fast and precise flat surfaces on a wide variety of materials. Blanchard surface grinders are used for everything from steel to glass for optical lenses to silicone wafers for semiconductors to tough to machine ceramics.
view more2023127 · Edge Grinder Edge Grinder is equipment to grind edge of all kinds of substrate materials for a specified profile. Our wide range of Edge Grinder lineup can support substrates of any material kind, such as silicon, metal, SiC, sapphire and oxide substrates, featuring easy operation and maintenance.
view more2022526 · In metal works, Grinding is the metal removal process by the application of abrasives which are bonded to form a rotating grinding wheel.
view moreDaitron's WBM -2000A Series Wafer Bevel Machine is a wafer edge grinder engineered to create a bevel on wafers ranging from 2 inches to 8 inches in diameter. It features a compact design, superior precision beveling, and exceptional versatility. This wafer edge grinder can process various materials, including silicon and other semiconductive ...
view moreBased on over 30 years' experiences in design, production and service of crushing and s
GET QUOTE