2022820 · In this article, a method of grinding small ceramic elements using hyperboloid and conical grinding wheels was presented. The method allowed for machining with a lower material removal speed and extending the grinding zone without reducing the efficiency of the process. In order to assess the process output parameters, numerical …
view more20191120 · High-strength alloys have significant application values in aerospace industry due to their excellent mechanical properties. However, grinding of these alloys, which is generally used for precision machining, suffers from problems like high grinding temperature and poor surface quality. Having relatively lower grinding temperature and …
view more2023828 · To investigate the micro-grinding process and performance of 2.5D Cf/SiC composites and 2.5D SiCf/SiC composites in depth, single-factor micro-grinding experiments were conducted by using SiC ceramics as a comparison. Differences in the material removal process, surface microstructure, surface roughness, and grinding force of the three …
view more20161231 · In the recent years, a number of micro-manufacturing processes have been developed to produce such miniature and complex structures. Micro-grinding is one such process that has been proved optimal ...
view more201011 · Abstract Ultra-precision grinding is primarily used to generate high quality and functional parts usually made from hard and difficult to machine materials. The objective of ultra-precision grinding is to generate parts with high surface finish, high form accuracy and surface integrity for the electronic and optical industries as well as for astronomical …
view more202021 · The influence of maximum radial height grits on surface generation in micro grinding has been verified experimentally for up and down grinding modes. Microscopic observations of ground surfaces have shown the distinct differences between up and down grinding modes, which are similar to the surface generation in milling processes.
view moreIn micro-grinding, the improvement of machining accuracy has received increasing attention recently. However, the real-time dynamic change for taking into the grinding thickness during the machining process, combined with the complex vibration characteristics of the spindle, complicates the theoretical treatment.
view more2024615 · Abstract The quality of micro-grinding and laser stealth combined dicing (MGSD) cut sidewalls of vertical silicon carbide (V-SiC) wafers has a significant impact on chip lifetime and mechanical reliability. The cracks generated by micro-grinding in the coupling region are an important factor affecting the surface quality of the cutting sidewall.
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