NFE-2200 Model은 4개의 Wafer Cassette에서 WTR을 이용하여 최대 Ø8” Size Wafer를 자동으로 Loading한 후 Edge Grinding Wheel 을 고속으로 회전시켜 Wafer 의 외경 및 모서리 부분을 가공 하는 장치입니다. CCD Sensor 이용 하여 Wafer 외경을 측정 후 자동으로 Align 하는 기능을 갖추고 ...
view more5 · We offer systems for high-precision wafer edge profiling directly after the wafers have been sawn out of the silicon single crystal (ingot). The modular system of the ACCRETECH Wafer Edge Grinder can be configured for wafer sizes from 2-12″ and for diverse materials (Si, GaAs, sapphire Si, SiC). Thanks to its compact design, the wafer …
view more201291 · This study presents design of an ultra-precision wafer grinder which incorporates state-of-the-art automatic supervision and control system. The wafer grinder is characterized by wafer surface shape control, grinding forces and wafer thickness monitoring systems. The design provides a totally integrated solution to the ultra-precision grinder …
view more6 · Wafer backgrinding, or wafer thinning, is a semiconductor service designed to reduce wafer thickness. This complex manufacturing process produces ultra-thin wafers for stacking and high-density packaging in compact electronic devices.
view more200511 · This paper addresses an important aspect of silicon wafer fine grinding: machine design. For any commercially available wafer grinders, spindle angle …
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view more201664 · You’ll love my easy to follow Tuiles Recipe – wafer thin crispy perfection to top ice cream or desserts. Ideal to use up leftover egg whites ! This French tuile recipe includes instructions for Almond Tuiles, Chocolate Dipped Tuiles and Biscuit Curls.
view moreThe Company has leveraged its significant intellectual property portfolio to develop the new flagship 6EZ Silicon Carbide Polisher, which, alongside the 7AF-HMG Silicon Carbide Grinder, provides Revasum’s customers with an optimized, fully automated single-wafer grind and polish toolset. The solution is configurable for SiC wafers 200mm and below.
view moreBased on over 30 years' experiences in design, production and service of crushing and s
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