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20221115 · The electrochemical cut-off grinding (ECCG) process is a chemical energy-based hybrid machining process in which material is removed from the workpiece by anodic dissolution along with mechanical abrasive action. Ti–6Al–4V is the most demanding material to make the components in aircraft and aerospace industries due to their …
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2024428 · In silicon carbide processing, the surface and subsurface damage caused by fixed abrasive grinding significantly affects the allowance of the next polishing process. A novel grinding wheel with a soft and hard composite structure was fabricated for the ultra-precision processing of SiC substrates, and the grinding performance of the grinding …
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2023929 · The grinding force is a crucial indicator of material removal process, which directly affects machining efficiency, surface quality and tool life. The…
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2023711 · Wafer backgrinding is a crucial step in semiconductor manufacturing, as it prepares the wafer for further processing and packaging. The procedure comprises the thinning of silicon wafers by scraping out material from the backside, which is crucial for enhancing the functionality and dependability of semiconductor devices. This article …
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202339 · Grinding Machine Contents show A grinder is commonly used to precisely shape and finish the given materials with low surface roughness and high surface quality. A grinding machine is a type of machine used to grind workpieces. It basically uses emery or an abrasive wheel as the cutting tool. The grinding process is truly a chip-producing …
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2010610 · Hence, there is a need to apply most recent and powerful optimization techniques to get desired accuracy of optimum solution. In this paper, a recently developed nontraditional optimization technique, particle swarm optimization (PSO) algorithm is presented to find the optimal combination of process parameters of grinding process.
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202261 · The inherent characteristics of grinding forces in 2D-UAG of hard and brittle materials can be explained by obtaining the variation trends of the average cutting depth of individual grit and the number of active grains. The modeling methodology presented in this study provides a reference for studying the 2D-UAG process of brittle materials.
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202431 · Highlights • Summary of grinding residual stress generation mechanism and its future research outlook. • Elaboration of grinding residual stress modelling and summary of material removal mechanisms. • Summary of research on the mechanism of change in microscopic material processing and its research significance. • Application of residual …
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20041210 · The impact of material properties in grinding processes is twofold: •. the objective of the comminution process is the production of well-defined product properties, •. particles' transport to the stressing zone and particles' reaction to applied stresses depend on their inherent mechanical material properties.
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2009319 · Grinding rate is very high, which makes grinding to be materials removal process of high temperature, high strain and high strain rate ( Tönshoff et al., 1992 ). The material strain rate in grinding process is usually one order of magnitude larger than common cutting process, and furthermore, size effect exists ( Chen and Tang, 2007 ).
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