improved mechanical grinding method for

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  An experimental investigation of silicon wafer thinning by …

  202231 · Abstract Three-dimensional integration using through-silicon via (TSV) can significantly improve the performance and power consumption of microelectronic devices. In order to connect more chips vertically using TSV, the silicon wafer should be as thin as possible. As the most widely used method for wafer thinning, constant-feed grinding …

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  An Improved Method for the Extraction of Nucleic Acids …

  2021126 · We previously reported a method for the extraction of nucleic acids without mechanical tissue grinding using a buffer containing potassium ethyl xanthogenate (PEX) to detect viroid RNAs.

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  A new magnetic enhanced chemical mechanical polishing method …

  202461 · The material removal mechanism by which the magnetic field enhanced chemical mechanical polishing was revealed by comparing the surface morphology and reaction products with and without magnetic assistance. The method proposed in this study focuses on exploring the feasibility of this composite polishing process for quartz internal …

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  Grinding and Finishing - IIT Mechanical

  20231228 · Honing and Superfinishing. Honing tool used to improve the surface finish of bored or ground holes. Schematic illustrations of the superfinishing process for a cylindrical part. (a) Cylindrical mircohoning, (b) Centerless microhoning.

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  Optimization of high-speed grinding parameters for anti …

  202291 · High-speed grinding technology is being applied to the precision machining of 20CrMnTi steel gears, shafts and bearings suffering from fatigue damage. The response surface methodology (RSM) was used as an optimization method of high-speed grinding parameters to reach a higher anti-fatigue performance of 20CrMnTi steel workpieces. The …

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  (PDF) Modelling of grinding mechanics: A review

  2022101 · To fill this gap, this work reviews and introduces theoretical methods and applications of mechanics in grinding from the aspects of modeling principles, limitations and possible future ...

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  An improved chip-thickness model for surface roughness …

  201992 · Experiments are conducted to verify the reasonability of the improved chip-thickness model from the perspective of surface roughness, and the findings are likely to clarify the differences in material removal mechanism between wheel grinding and robotic belt grinding essentially.

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  Wafer Thinning: Techniques for Ultra-thin Wafers

  Thinning Techniques. There are four primary methods for wafer thinning: mechanical grinding, chemical mechanical polishing (CMP), wet etching and atmospheric downstream plasma (ADP) dry chemical etching (DCE). Because of its high thinning rate, mechanical grinding currently is the most common technique for wafer thinning.

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  Review Mechanical behavior and modeling of grinding force: …

  2023929 · The force model, which plays a significant role for the application of grinding in various fields, is the most straight forward and comprehensive mathematical expression to describe the mechanical behavior of material removal. However, current research primarily focuses on modeling of grinding force in simple processes and …

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  Residual stress generation in grinding: Mechanism and …

  202431 · Highlights • Summary of grinding residual stress generation mechanism and its future research outlook. • Elaboration of grinding residual stress modelling and summary of material removal mechanisms. • Summary of research on the mechanism of change in microscopic material processing and its research significance. • Application of residual …

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